Bonded Marketplace Bond Protocol Closes $2.5 Million Seed Round

Bond Protocol has closed a $2.5 million seed round led by Chapter One Ventures and IDEO CoLab Ventures, with participation from Alchemy Ventures, Hypersphere, and others.

Previously, the vote on OlympusDAO's proposal to split the bonded marketplace Olympus Pro and rename it Bond Protocol was approved, and OlympusDAO would process its bonds through Bond Protocol. Bond Protocol would reportedly feature Permissionless Markets, Composable Bonds (tokenized), Modular Auction interfaces, and more. On October 4th, Bond Protocol's beta dapp was live.